Provides high-efficiency protection for 300mm wafers during transportation and storage. The excellent air tightness and purge function can maintain the inside of the FOUP in a clean, low-humidity environment. Low outgassing and low moisture absorption materials can effectively reduce the risk of wafers being contaminated due to outgassing. All dimensions are in compliance with SEMI specifications, and can be customized according to machine parameter settings to ensure compatibility between the FOUP and machine.