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300mm Wafer Handling

300mm Wafer Carrier

300mm FOUP for RSP200/150 Transport

FOUP is used as the external contour framework and KC disk surface and spring mechanism are installed inside. This provides high-efficiency protection for 6-inch mask box during transportation, loading and storage. The excellent air tightness and purge function control temperature and humidity within the FOUP environment.
  • Size
    300mm (12 in.)
  • Material
    GBM