• Establishment Date： March 20, 1998
• Founder：
  1. Ming-Chien Chiu Chairman and CEO
  2. Tien-Jui Lin Vice Chirman and General Manager
• Date of Share Capital： NT$942,972,320
• Number of Employees： 640

• Headquarters：9th Floor, No. 2, Sec. 4, Zhongyang Rd., Tucheng District, New Taipei City, Taiwan
• Tainan Tree Valley Plant：No. 17-1, Zilian Rd., Xinshi District, Tainan City, Taiwan
• Taipei Fuxing Plant：No. 21, Fuxing St., Tucheng District, New Taipei City, Taiwan
• Tainan Science Branch：2F-1, 2F-2, No. 23, Nanke 3rd Rd., Xinyi District, Tainan City, Taiwan

Mission
Providing global critical materials and innovative technologies

Cultivate
Cultivating global professionals in critical material innovation technology

Vision
The preferred partner for global semiconductor industry leaders in critical material innovation technologies

Gudeng Precision was established in 1998, initially focused on CNC machining of plastic shell molds. In the second year, we successfully entered the semiconductor front-end photolithography process equipment and parts field, starting the development of photolithography process components and forming close partnerships with customers to provide photomask carrier solution products. To date, Gudeng Precision is the market leader in high-end photomask carrier solutions.

In 2008, we officially entered the wafer carrier solution market, positioning ourselves as the "Integrated Service Provider of Innovative Technology for Critical Materials Worldwide". We became the first and only Taiwanese company to participate in the international 18-inch semiconductor equipment process development, a critical step for the world's semiconductor process to move towards the next generation – 18 inches (450mm) technology. In 2019, our EUV Pod became the first in Asia and one of only two worldwide to be certified as a critical product by ASML, the world's largest semiconductor equipment manufacturer in the photolithography market. With top CNC technology and precise processing capabilities up to mirror level, it has been applied to product appearance, improving exposure efficiency, reducing rework, and enhancing process yield. It has become a new milestone in the transfer of advanced semiconductor process technology, and a necessary advanced photomask carrier for the mass production of 3-nanometer chips using Extreme Ultraviolet (EUV) lithography by international semiconductor giants, transforming Gudeng Precision from a mold manufacturer in the manufacturing industry to a world-class Taiwanese semiconductor company, creating a unique industry position.

Throughout our journey, we have upheld the principles of technological leadership, product innovation, and long-term trust in our customer partnerships. We are committed to focusing on the semiconductor industry as our core development area, with a comprehensive solution-based approach as our main service strategy. Gradually, we have established a unique "Innovative Service Business Model" based on the core values of "Partner with H.E.A.R.T., Grow with P.A.S.S.I.ON". We emphasize the innovation value of "Co-Creation" and build an integrated supply platform for advanced industry processes.

We firmly believe that "listening sincerely to customer needs and consistently creating value beyond their expectations is the origin of all innovation and the starting point for the sustainable operation of Gudeng Precision".

In 2020, Gudeng Precision officially entered the aerospace field, replicating our successful experiences from the semiconductor industry. We applied our core expertise in precision machining technology to critical aerospace components requiring high-precision processing. Successfully, we impressed customers with quick sample delivery, expanding applications, and a global customer base.

• In 2021, we obtained aerospace AS9100D certification.
• In 2023, we received approval from the Federal Aviation Administration (FAA) as an aircraft parts manufacturer.
• In 2023, we obtained NADCAP special process certification.

Gudeng has invested decades of effort in the research and development of key products such as our EUV POD and FOUP, achieving high market share and multiple growth in production. We will continue to innovate technology and optimize system management integration, providing customers with one-stop solutions for high-end photomasks and wafer carriers. We also aim to diversify development into the aerospace industry, with the group's goal of achieving annual revenue of billions in five years.

We are expanding capital expenditures, establishing a new headquarters building in the Tu Cheng Industrial Zone as a backup production base for photomasks, and beginning construction of the Longfu factory in Sanxia District. Specialized product quality control management, combined with automated system management, will reduce error costs, improve yield, efficiency, and production capacity. With the goal of low-carbon transformation and intelligent automated manufacturing plants, we plan to invest NT$5 billion locally over five years, creating 1,200 to 1,500 job opportunities to develop a talent pool for the semiconductor industry in Taiwan.

In 2022, the Gudeng-led upstream and downstream sustainable supply chain committee set a 2-year target for a 15% reduction in electricity consumption and a 3-year plan to implement a digital carbon management platform. We are guiding 30 companies to take actions for zero net emissions and carbon reduction through greenhouse gas inventory and evaluation of the carbon footprint of key products, aiming to achieve our carbon reduction target. Leading by Example, Gudeng commits to and declares the implementation of RE100 by 2040 to supply renewable energy. The board of directors also approved investment in solar power plants with energy storage equipment for direct power supply. We are striving to achieve the target ahead of schedule by 2030, contributing to society with renewable energy and dedicating our efforts to the sustainable development of the planet.